If you compare Intel's quad-level cache, and AMD's 3D cache...
Intel: The Making of a Chip with 22nm/3D Transistors | Intel - YouTube
3 Ways 3D Chip Tech Is Upending Computing - IEEE Spectrum
Intel Announces first 22nm 3D Tri-Gate Transistors, Shipping in 2H 2011
Intel previews the Foveros 3D packaging technology in upcoming Lakefield hybrid CPUs - NotebookCheck.net News
Intel Details their Lakefield Processor Design and Foveros 3D Packaging Tech | OC3D News
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Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
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Intel launches its Lakefield 3D packaged hybrid processors - CPU - News - HEXUS.net
Intel introduces Foveros: 3D die stacking for more than just memory | Ars Technica
Intel Lakefield 3D Foveros Hybrid Processors: Hot Chips 31 Live Coverage | Tom's Hardware
Intel To Detail 3D Chip Packaging For Next-Gen Meteor Lake And Arrow Lake CPUs | HotHardware
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Intel's LEGO-Like Chiplet Design For Next-Gen Meteor Lake, Arrow Lake & Lunar Lake "3D Foveros" CPUs Detailed
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3 Ways 3D Chip Tech Is Upending Computing - IEEE Spectrum
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A Stacked CPU: Intel's Foveros - The Intel Lakefield Deep Dive: Everything To Know About the First x86 Hybrid CPU
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Intel unveils new 3D chip packaging design | Network World
Intel Shows Off New Xeon Max Processors Ahead of Supercomputing '22 - News
